Category Archives: Technology

Long Live the (8 Bit) King

There are whispers that their time has come to fade away into the sunset. Time to drift away on the electronic wind with laser discs, Zune players, and VHS. But can the role of 8 bit MCUs in the electronic engineering ecosystem be dismissed so easily? Maybe not. In this week’s episode of Fish Fry, Nikos Zervas (CEO of CAST) joins us to discuss the changing role of 8 bit MCUs in the EE ecosystem, how CAST works with their partners to bring innovative IP cores to the market, and how their new GZIP data compression IP can reduce power consumption for a variety of designs. Also this week, we check out a new open source, autonomous car platform from StreetDrone and reveal how you can bring the convenience and ease of Arduino into the professional realm.

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Links for July 13, 2018

More information about CAST IP

More information about StreetDrone

Youtube Video: Wayve Renault Twizy in Action

Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

New Episode of Chalk Talk: Bringing Arduino Into the Professional Environment

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What (Invisible) Dreams May Come

This week’s episode of Fish Fry, we take a closer look at two childhood dreams of mine: an invisibility cloak and robots that can think! (ie. artificial intelligence.) First up, we examine why an invisibility cloak is closer to reality than ever before, the physics behind invisibility/cloaking, and important differences between three new cloaking technologies. Also this week, I sit down with Carlos Macian from eSilicon and talk about how ASICs and GPUs are being used as building blocks for artificial intelligence designs. Carlos and I chat about the intersection of AI and network design, the role GPUs play in artificial intelligence design and why basketball is just like a game of chess.

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Links for July 6, 2018

Full-field broadband invisibility through reversible wave frequency-spectrum control (Whitepaper)

More information about eSilicon

New Episode of Chalk Talk: Debug and Verify FPGA Algorithms with MATLAB and Simulink

 

Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

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To the Cloud and Beyond

Watch out world! Fish Fry is taking DAC by storm! In this week’s episode of Fish Fry, we tackle of some of biggest themes presented at this year’s show: EDA’s progression to cloud-based design tools, the increased adoption of the RISC-V architecture, and the ever-present IoT. Craig Johnson and Carl Siva (Cadence Design Systems) join us to chat about why now is the right time for the cloud to take off for EDA and some of the advantages and pitfalls that will come along with this movement to cloud-based tools. [remove extra space here] Rick O’Connor (RISC-V Foundation Chairman) also joins us to discuss the growing RISC-V ecosystem and some of the cool stuff offered at the DAC RISC-V Pavillon. Addressing the big IoT presence at this year’s show, we also chat with John Stabenow and Jeff Miller (Mentor) about the unique challenges IoT presents us as engineers and why their booth had a big ol’ car tire as an example of Tanner EDA in action. To wrap things up, we lay out our DAC Details You May Have Missed including best swag, best booth, and best coffee!

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Links for June 29, 2018

More information about DAC 2018

More information about Tanner EDA

More information about the Cadence Cloud - the Future of Electronic Design

Check out the EE Journal twitter feed from DAC 2018

Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

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Enabling Intelligence and Designing for a Cause

Work it harder

Make it better

Do it faster

Makes us stronger

-- Harder, Better, Faster, Stronger by Daft Punk

The Internet of things once again takes center stage in this week’s episode of Amelia’s Weekly Fish Fry. First up, we chat with Dianne Kibbey (Newark element14) about the Design for a Cause Design Challenge: Newark element14’s newest design challenge that encourages the development of assistive technologies. Also this week, Martin Croome (VP of Business Development at GreenWaves Technologies) joins us to discuss the details of GreenWaves’ GAP8 IoT Application Processor and the how open source innovation has been integral to the success of this fabless semiconductor company.  

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Links for June 22, 2018

More information about Newark element14's Design For a Cause Design Challenge

More information about GreenWaves Technologies

New Episode of Chalk Talk: Intelligent Power Modules

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Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

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There’s No Business Like EDA Business

In this week’s podcast, we welcome Bob Smith from the Electronic System Design (ESD) Alliance to Fish Fry. Bob and I are chat about why the ESD Alliance and SEMI are joining forces, the ESD Alliance’s plans for DAC this year, and we even fit in a little discussion about wine. Also this week, we check out the new artificial intelligence and machine learning program at this year’s Design Automation Conference and I announce my “Do Not Miss List” for DAC 2018.

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Links for June 15, 2018

More information about the ESD Alliance 

 DAC Sponsor ESD Alliance to Become SEMI Strategic Association Partner; Invites Attendees to Learn More

More information about DAC 2018

SKY Talk: DARPA is Building a Silicon Compiler

Free Doulos Lunch'N'Learn Taster Session: Python for Scientific Computing and Deep Learning

The Future of Computing: Pushing the Limits of Physics, Architectures & Systems for AI

 

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Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

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MEMS Spring Eternal

What do electrostatic transduction, non-linear MEMS sensors, caffeine dosing strategies, and a glowing Death Star have in common? This here podcast! First up, we explore the Global MEMS Design Contest with Christine Dufour (Coventor - A LAM Research Company). Christine and I discuss the details of the winning designs and how design contests foster innovation in the electronic engineering ecosystem. Also this week, we check out an algorithm developed by the United States Army that aims to “optimize an ideal caffeine dosage strategy” and take a closer look at the “The World's Most Accurate Death Star Replica Firepit”.

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Links for June 8, 2018

Caffeine dosing strategies to optimize alertness during sleep loss (Whitepaper)

More information about Coventor - A Lam Research Company

Global MEMS Design Contest Winners Announced

The World's Most Accurate Death Star Replica Firepit by West Coast Firepits

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Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

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SensAI and Sensibility

“Success is where preparation and opportunity meet.” Bobby Unser

Many of us would love to get started on an artificial intelligence-enhanced IoT edge device design but we're not sure how to get started. In this week’s episode of Fish Fry, I sit down with Deepak Boppana and we talk about a new technology stack unveiled by Lattice Semiconductor called sensAI. Deepak and I explore the details of the sensAI technology stack and why the power and cost components of this stack set it apart from other solutions. Also this week, we investigate how China is aiming to be the world leader in artificial intelligence by 2030 and how they are using AI and facial recognition in their school system today. 

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Links for June 1, 2018

More information about the Lattice sensAI Stack

Ultra-Low Power Lattice sensAI Leads Mass Market Enablement of Artificial Intelligence in Edge Devices

New Feature Article by Kevin Morris: More AI at the Edge - Lattice Launches sensAI Stack

China wants to be a $150 Billion World Leader in AI in Less Than 15 Years (CNBC)

Chinese School uses Facial Recognition to Make Kids Pay Attention

New Episode of Chalk Talk: Deep Learning with MATLAB

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Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

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Controlling the Spectrum and the Future of Battlefield Tech

Embedded computing is the name of the game in this week’s episode of Amelia’s Weekly Fish Fry. First up, Roy Keeler (ADLINK) and I chat about how we can overcome processor speed bumps, the general rule of thumb when it comes to spectrum dominance, and the evolution (and future trajectory) of GPPs. In our second interview this week, Mike Slonosky (Curtiss-Wright) and I talk about the increased implementation of Arm cores in Mil/Aero designs and the details of their new 3U VPX for safety-critical designs.

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Links for May 25, 2018

More information about ADLINK

More information about Curtiss-Wright

New Episode of Chalk Talk: Smart IoT Design

Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

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Silicon Carbide’s Time to Shine

We’re running the gamut of electronic design in this week’s episode of Fish Fry. Chris Dries (CEO - UnitedSiC) and I discuss some common cascode issues facing hardware designers today and what UnitedSiC is doing to help ease the pain of those issues. We also chat about the advantages (and limitations) of silicon carbide and why he thinks silicon carbide will become the semiconductor of choice for power electronics. Also this week, we check out a tiny but mighty insect-sized robot called the RoboFly. Coming out of the University of Washington, this robotic flying machine is only slightly heavier than a toothpick and is powered by a laser. Yes, you heard me right - a laser!

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Links for May 18, 2018

More information about UnitedSiC

The first wireless flying robotic insect takes off (University of Washington News)

The first wireless flying robotic insect takes off (Youtube Video)

New Episode of Chalk Talk: Via to Via Coupling Through Plane Cavities

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Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

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