In this week’s podcast, super tiny technology is taking center stage! First up, I check out world’s first and smallest sensor that can enable touch gestures through any material. Dan Goehl (Co-founder and Chief Business Officer at UltraSense Systems) joins me to discuss how UltraSense’s new 3D ultrasound sensor is going to usher in a whole new era in user interfaces. Also this week, I investigate the world’s smallest antenna developed by a group of researchers at the Université de Montréal and how this new nanoantenna will help scientists better understand nanotechnologies and identify new drugs.

It’s a bird, it's a plane, it's the largest AI processor ever made!  In this week’s Fish Fry podcast, Andy Hock (Cerebras Systems) joins me to chat about the largest AI processor ever made -  the 7 nm wafer scale engine 2, the details of their brain-scale AI training, and how Cerebras Systems is democratizing access to high performance AI computation. Also this week, I check out a new kickstarter campaign called the SPORTSMATE 5: the world’s first and lightest portable wearable robotic exoskeleton that aims to alter the way we interact with the world by applying exoskeletons to daily life. 

In honor of the SEMICON West 2021 and the Design Automation Conference that took place in San Francisco this week, my guest is Bob Smith from ESD Alliance. Bob and I are chatting about a new anti-piracy server certification protocol for software license management and why this kind of server certification protocol is needed now more than ever before. Also this week, I take a closer look at a new simplified quantum computer developed by a team of researchers at Stanford University. (Spoiler Alert: They use off the shelf parts!) 

This week's podcast is all about the future of 3D IC tools and methodologies and the newest advancement in xenobot research. Vinay Patwardhan (Cadence Design Systems) and I discuss the challenges engineers experience when designing 3D chips, where existing 3D-IC tools and methodologies fall short, and what type of analysis we need for a 3D stack system as opposed to a standard chip design. Also this week, I investigate how a group of researchers from the University of Vermont, Tufts University, and the Wyss Institute for Biologically Inspired Engineering at Harvard University have discovered a brand new form of biological reproduction and how they used this new discovery to create the world’s first self-replicating living robots.

We are switching things up for our sixth installment of my new special edition series of our long-running Fish Fry podcast called “Makers Today!”, where we highlight the movers and shakers in the maker space. In this month’s episode, my guests are Katie Clubb and Richard Curtin from OKdo! Katie, Richard and I chat about OKdo’s mission to encourage inspiration with the Okdo Projects Hub, how you can recycle your pre-loved Raspberry Pis with their new Okdo Renew Program and how they are encouraging STEM education throughout the world.

On your mark. Get set. Let’s fry some fish! In this week’s podcast I am happy to bring in Joe Speed from ADLINK to talk all about the Indy Autonomous Challenge, the first autonomous race car competition at the Indianapolis Motor Speedway! Joe and I dig into some of the behind-the-scenes work at this first of its kind autonomous challenge including details of the ADLINK AVA-3501 series rugged edge platform that was supplied to each of the teams, the IAC base vehicle software, and more!

In this episode of Fish Fry, Peter Peumans (Imec) joins me to discuss an exciting breakthrough in COVID-19 testing spearheaded by miDiagnostics and Imec. We take a closer look at what sets this new kind of testing method apart from other testing methods on the market today, the details of Imec’s silicon chip technology that lies at the heart of this new technology, and how this kind of testing method could revolutionize how we test for other diseases in the future. Also this week, we check out a new 3D printing method developed by a team of researchers from the University of Notre Dame and Purdue University that integrates functional and structural materials into a single streamlined printing platform.