Amelia's Weekly Fish Fry

Harnessing Light and Redefining What is Possible: Lightelligence and The Rise of Optical Computing

This week’s Fish Fry podcast is all about photonics and the future of optical computing! Maurice (Mo) Steinman from Lightelligence and I chat about why Lightelligence is on a mission to be the leader in silicon photonics computing, the details of PACE (Lightelligence’s first fully integrated optical computing platform), and what sets this computing platform apart from traditional silicon chips.

 

The Pursuit of Performance: How AI can Help Optimize Electronic System Design

In this week’s Fish Fry podcast, Ben Gu from Cadence Design and I chat about bringing AI to the world electronic system design! We investigate the electronic system design challenges engineers are facing today, the benefits that AI brings to electronic system optimization and the details of Cadence’s Optimality Intelligent System Explorer. Also this week, I examine a new laser charging system developed by researchers from Sejong University that was able to wirelessly transmit power over one hundred feet. 

Re-Inventing Home Security: Infineon’s New AI/ML-based Smart Alarm System

In this week’s Fish Fry podcast, David Jones (Infineon) and I chat about Infineon’s new battery-powered Smart alarm system. We examine the role that AI and machine learning-based sensor fusion plays in this industry-first acoustic event detection and alarm system and why this kind of battery-powered home security sensor systems could be a game-changer for homes and businesses alike. Also this week, I investigate a new self-charging device developed by a team of researchers from National University of Singapore that can generate electricity from moisture in the air.

 

The Next Wave of Semiconductor Innovation

In this week’s Fish Fry, we are talking about electrostatic multi-nozzle printing technology, industrial microfabrication, and life-like lasers! Walter Braun (COO – Scrona) and I investigate the biggest challenges facing the microfabrication industry today, why Walter believes that the next wave of semiconductor innovation will rely on novel semiconductor packaging, and the details of Scrona’s multi-nozzle printing technology. Also this week, I examine new self-organizing lasers built by a team of researchers from Imperial College London and University College London that could lead to new materials for sensing, computing, light sources, and displays.

 

 

Opening the Door for Manufacturing Innovation: PulseForge Develops a New Form of Thermal Processing

What if we could revolutionize manufacturing and save energy at the same time? My guest is PulseForge CEO Stan Farnsworth and we are digging into the details of PulseForge’s new digital thermal processing. Stan and I investigate how this kind of thermal processing differs from traditional thermal processing and how it can vastly reduce the amount of energy used in manufacturing. We also take a closer look at each of PulseForge’s application areas, including curing and sintering, soldering and debonding, and why Stan believes that rethinking manufacturing is crucial to future electronic design innovation. 

 

Eliminating the Battery Altogether: How Powercast is Opening New Avenues of Innovation with RF Wireless Power and RF Wireless Harvesting

In this week’s Fish Fry podcast, Charlie Green (Chief Operating & Technical Officer at Powercast) joins us to discuss how Powercast is powering new avenues of innovation with their RF energy harvesting and wireless power. We are digging into the details of some super cool new designs that utilize Powercast technologies including a 3D printable discrete wearables for at-home medical monitoring, diagnosis and athletic training, a robotic autonomous price-changing system, an over-the-air wireless charging grip for Nintendo Joy-Con Controllers, and more!

 

FloatingPoint DSP for You and Me: Why Today’s Real World Designs Need FloatingPoint Digital Signal Processing

What do sweat-powered batteries and FloatingPoint digital signal processing have in common? This week’s Fish Fry podcast of course! We start things off with an investigation into the details of a revolutionary new battery developed by NTU Singapore that is powered by sweat and includes a unique silver flake electrode design. Also this week, Ted Chua (Cadence Design Systems) joins me to discuss the need for floating point digital signal processing today and the details of Cadence’s new Tensilica FloatingPoint DSPs.

 

Taking Piracy out of the Driver’s Seat

In this week’s Fish Fry podcast, Ted Miracco (CEO - Cylynt) and I discuss the increased prevalence of software piracy in the automotive industry and what can be done to stem the tide of unauthorized software use today. We also discuss the current state of cybersecurity today and the details of their upcoming Cylynt Connect Software Monetization and Anti-Piracy Summit.  Also this week, I investigate a new soft and stretchable metal alloy-based energy harvester that converts movement into electricity developed by a team of researchers from North Carolina State University. (Spoiler alert: it works underwater too!)

Papa’s Got a Brand New Node: Intel Makes Waves in Process and Packaging

On your mark. Get set. Let’s fry some fish! In this week’s podcast, I chat with Sanjay Natarajan (Senior Vice President and Co-General Manager, Logic Technology Development at Intel) about what the roadmaps for Intel’s process and packaging technologies looks like, the motivations behind Intel’s move to a new node naming convention, and what Sanjay believes will be the key factors that will drive the continuation and success of Moore’s Law. Also this week, I check out how new research from the University of Tsukuba is improving the possibility of launching rockets using a high-power beam of microwave radiation.

Machine Learning and The New Age of Intelligent Chip Design

Machine learning is once again taking center stage in this week’s Fish Fry podcast! Rod Metcalfe (Cadence Design Systems) joins me to discuss the role of machine learning in the future of chip design, why implementation teams are having a hard time keeping up with today’s advanced node designs, and how advancements in computer science are helping usher in a new age of intelligent chip design. I also take a closer look at how a team of researchers is using machine learning to help us more accurately predict how new materials deform, fail and even transfer heat at the atomic scale.