Amelia's Weekly Fish Fry

In this week's podcast I investigate VITA, MOSA, and mission critical distributed processing systems! My guest is Daniel Toohey from Mercury Systems. Daniel and I discuss the new VITA 100 standard, how MOSA aligns with VITA and the critical role that system management plays in distributed systems. I also check out new research that questions long-held assumptions about where life can exist in the solar system.

My special guest this week is Dermot O’Shea, CEO of Taoglas! Dermot and I discuss the biggest design and development challenges engineers face today when integrating connectivity into their designs, how Taoglas can speed up time to market for IoT designs and the educational resources included in the Taoglas AntennaXpert.

This week’s podcast is all about how shifting left can enable software defined vehicle innovation. My guests Wensi Jin from MathWorks, Thomas Hülshorst from FEV.io and I chat about the demand for software defined vehicles today, the engineering challenges associated with SDVs and why it is important to adopt a shift left mentality when it comes to SDV innovation.

This week’s Fish Fry is all about AI inference, NPUs and the Tensilica NeuroEdge 130 AI Co-Processor! My guest is Amol Borkar from Cadence and we are chatting about the latest trends in AI inferencing, why there is a greater need now for AI co-processors than ever before and the multitude of benefits that the Tensilica NeuroEdge 130 AI Co-Processor can bring to your next design.

This week’s podcast is all about open source development. My podcast guests are Julie Chen and Engineering Leader Tim Juravich from Deloitte.  Julie, Tim and I discuss the challenges of open source development today, how developers can navigate these issues, and where the open source road is headed in the future. Also this week, I check out a super cool collaboration called the Moon-Rice project that aims to develop the perfect crop for sustaining life in space for long-duration missions. 

My podcast guest this week is Jan Zimmerman from TEWS Technologies. Jan and I are talking all about VITA 93 – a new QMC mezzanine card standard and why scalability, modularity and flexibility are central elements of this new standard. Jan and I also discuss the unique I/O capabilities of QMCs and how TEW Technologies is furthering innovation in this arena. 

My podcast this week is Eric Biel from Powercast! Eric and I explore each of Powercast’s innovative wireless power solutions, the origins of their Lifetime power solution, the benefits of their next generation RFID tags, and super cool new applications they unveiled at the Consumer Electronics Show this year.

Automotive design takes center stage in this week’s podcast. My guest is Chet Babla from indie. Chet and I chat about the automotive megatrends driving automotive innovation today. We also explore how radar and vision will shape the future of in-cabin and exterior automotive applications and how indie is supporting the next generation of vision and radar applications with their advanced silicon, photonics and sensor system solutions. Also this week, I check out the details of a new  thermoelectric generator prototype that can convert exhaust heat into electricity.

Welcome to our second annual International Women in Engineering Day Fish Fry podcast! My special guests are Sonja Brown from TDK, Chandana Tamma from Rehlko, and Sonja Ghelani from Texas Instruments. I sat down with each of these esteemed engineers and discussed their journeys into the world of high tech, how the EE landscape has changed over the years and what they would like to see in the future of engineering.

My podcast guest this week is Vibheesh Bharathan, Director and Project Lead for PSOC 4 Multi-Sense at Infineon. Vibheesh and I chat all about the benefits of Infineon's new PSOC 4 MCU family. We discuss the details of the Multi-Sense technology at the heart of these new MCUs and why innovative new liquid level sensing capabilities of these microcontrollers make them perfect for noisy environments. Also this week, I check out new electronic skin created for robots by the University of Cambridge and University College London that can give robotic hands the ability to feel pressure, heat and pain.